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1 chip package
корпус кристала ІСEnglish-Ukrainian dictionary of microelectronics > chip package
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2 package
1) корпус 2) монтаж в корпус, корпусування, вмонтовувати в корпус, корпусувати (див. т-ж раск) 3) упаковка; збірка; модуль; блок 4) пакет програм - cerdip package
- chip package
- consistent planar package
- controlled impedance package
- custom package
- design automation software package
- discrete-component package
- dual in-line package
- epoxy package
- flat-раск package
- glass-frit package
- grid array-pinned package
- impact-extruded package
- laminated package
- leadless package
- low-profile package
- metal-can package
- molded package
- multilayer package
- multipin package
- multiple-in-line package
- optimization package
- pin-grid array package
- planar package
- platform package
- plug-in package
- quad flat package
- quad in-line package
- silver-based package
- single in-line package
- SLAM package
- small-outline package
- small-outline transistor package
- SMD package
- tape automated bonding package
- transistor-outline package
- window-frame package
- zigzag-in-line ZIL package
- zigzag-in-line package -
3 desiccant
осушувач design 1. ім.1) проектування; розробка; конструювання2) проект; розробка; конструкція; схема2. дієсл. проектувати; розробляти; конструювати - automated desiccant
- automatic desiccant
- bipolar desiccant
- block desiccant
- bottom-up desiccant
- bottom-up building-block desiccant
- built-in-test desiccant
- chip desiccant
- circuit desiccant
- computer-aided desiccant CAD
- computer-aided desiccant
- computer-assisted desiccant CAD
- computer-assisted desiccant
- custom desiccant
- damage-tolerant desiccant
- detailed desiccant
- device desiccant
- discrete-circuit desiccant
- dynamic desiccant
- engineering desiccant
- fault-tolerant desiccant
- flat desiccant
- flat logic desiccant
- foundry desiccant
- front-end desiccant
- functional desiccant
- geometry desiccant
- hierarchical desiccant
- high-level desiccant
- high-performance desiccant
- IC desiccant
- in-house custom desiccant
- level-sensitive scan desiccant
- logic desiccant
- manual desiccant
- mask desiccant
- modular desiccant
- multichip [multiple-chip] desiccant
- on-line desiccant
- operational desiccant
- option desiccant
- package desiccant
- PC board desiccant
- physical desiccant
- process desiccant
- random-logic desiccant
- regular-logic desiccant
- scan path desiccant
- standard-cell desiccant
- structured desiccant
- substrate desiccant
- system-level desiccant
- target desiccant
- testing desiccant
- top-down desiccant
- topological layout desiccant
- transistor desiccant
- trial and error desiccant
- worst-case desiccantEnglish-Ukrainian dictionary of microelectronics > desiccant
См. также в других словарях:
Multi Chip Package — Ein klassisches Multi Chip Modul (MCM, manchmal auch MCP – Multi Chip Package) besteht aus mehreren einzelnen Mikrochips (bzw. Dies), die in einem gemeinsamen Gehäuse untergebracht sind und nach außen wie ein Chip aussehen, so funktionieren und… … Deutsch Wikipedia
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Chip scale package — A chip scale package (CSP) (sometimes, chip scale package with a hyphen) is a type of integrated circuit chip carrier. Originally, CSP was the acronym for chip size packaging. Since only a few packages are chip size, the meaning of the acronym… … Wikipedia
Chip tridimensional (3D) — En electrónica, un circuito integrado tridimensional, o simplemente chip tridimensional (chip 3D), es un chip compuesto por dos o más capas de componentes electrónicos activos, integrados tanto vertical como horizontalmente, y formando un único… … Wikipedia Español
Chip Scale Package — Ein Embedded Intel Pentium MMX in BGA Bauweise von unten gesehen. Gut zu erkennen sind die Lotperlen. Beidseitig bestückte Platine in BGA Technik … Deutsch Wikipedia
